Physicochemical properties of Silicon Nitride Si3N4 Pulp
Si3N4 has high-temperature insoluble properties. It exhibits high-temperature creep resistance. Hexagonal system. Crystals are hexagonal. The Si3N4 density obtained using the reaction sintering process is 1.8-2.7% g/cm3, while that obtained via hot-pressing is 3.12-3.22g/cm3. Mohs hardness (99.5), Vickers hardness (2200) and microhardness (32220MPa) are all 99.5. The melting point of the metal is 1900 when it is under pressure. At atmospheric pressure, it typically decomposes around 1900. Specific heat capacity is 0.71J/g*K. The heat of forming is -751.57kJ/mol. The thermal conductivity of the material is (2-155) W/(m*K). The linear expansion coefficient is 2.8~3.2×10-6/(20~1000).
Insoluble in water. Insoluble in water. The temperature at which oxygenation starts in the air is 1300-1400. The specific volume resistance of the air is 1.4×105 *m for 20 and 4×108*m for 500. The elastic modulus measures 2842046060MPa. The reaction sintering compressive strength is 490 MPa. At 1285, it reacts to dicalcium diazide and forms calcium diazide. At 600, it is reduced to a transition metal and released nitrogen oxides. The bending strength of the silicon halide is 147MPa. It can be made by heating silica powder in nitrogen, or reacting with ammonia to make silicon halide. The resistance is between 1015-1016O.cm. It can be used in high-temperature ceramic materials.
Other than hydrofluoric acid or hot phosphoric acid silicon nitride doesn’t react with any inorganic acids. It also has high corrosion resistance.
|Silicon Nitride Si3N4 Powder Properties|
|Other names||silicon (IV), nitride|
|Appearance||From white powder to gray powder|
|Solubility of H2O||Insoluble|
Silicon Nitride Si3N4 Pulverization
High thermal stability, high oxidation resistance and high dimensional accuracy are some of the benefits of silicon nitride clay material. The covalent compound silicon nitride has a high bond strength and will form an oxygen film in the atmosphere, which gives it excellent chemical stability. Silicon nitride can not be oxidized below 1200. A protective film can also be formed between 1200 and 1600 to stop further oxidation. Silicon nitride does not become infiltrated, or corroded from aluminum, lead or tin, silver or brass, or any other molten metals and alloys. However, it is susceptible to corrosion by magnesium and nickel-chromium alliance, as well as other molten liquids.
Silicon nitride ceramic materials are suitable for use in high-temperature engineering components , Advanced refractory for the metallurgical sector , Corrosive-resistant components Sealing components in the chemical, machining, and cutting industries.
Silicon nitride is a strong bond material that forms with silicon carbide (alumina), thorium oxide, boron and boron, among others.
Additionally, silicon nitride may be used in solar cells . After the silicon-nitride plated with the PECVD process, it can be used to reduce incident light reflections. In addition, the hydrogen atom from the reaction product enters silicon nitride wafer and the silicon silicon nitride movie, playing a function of passivation defect. The ratio of silicon nitrogen atoms to silicon nitride is not strictly 4:3, but can fluctuate depending on different technological conditions. Different atomic proportions correspond to different physical characteristics of the film.
You can also use it in Ultra-high temperatures gas turbines, aircraft engines and electric furnaces , etc.
Main Supplier of Silicon Nitride Powder Si3N4
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