Power chips are linked to exterior circuits via product packaging, and their efficiency relies on the assistance of the packaging. In high-power scenarios, power chips are generally packaged as power components. Chip affiliation refers to the electrical connection on the top surface of the chip, which is generally light weight aluminum bonding cord in conventional components. ^ Traditional power component bundle cross-section
At present, business silicon carbide power modules still primarily utilize the product packaging innovation of this wire-bonded standard silicon IGBT component. They encounter issues such as big high-frequency parasitical parameters, inadequate heat dissipation capacity, low-temperature resistance, and not enough insulation stamina, which restrict using silicon carbide semiconductors. The display of exceptional efficiency. In order to address these issues and totally manipulate the significant prospective advantages of silicon carbide chips, lots of brand-new packaging innovations and solutions for silicon carbide power components have emerged recently.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold cable bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold wires to copper cords, and the driving pressure is cost decrease; high-power gadgets have developed from light weight aluminum wires (strips) to Cu Clips, and the driving force is to boost product performance. The better the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to attach chips and pins. Compared with standard bonding packaging approaches, Cu Clip innovation has the adhering to benefits:
1. The link in between the chip and the pins is made of copper sheets, which, to a particular level, replaces the basic cable bonding method between the chip and the pins. For that reason, a distinct bundle resistance value, greater existing flow, and better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the cost of silver plating and bad silver plating.
3. The product appearance is completely constant with typical items and is mainly used in web servers, mobile computers, batteries/drives, graphics cards, motors, power supplies, and various other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding technique
Both the Gate pad and the Source pad are clip-based. This bonding approach is a lot more expensive and complicated, however it can attain far better Rdson and far better thermal results.
( copper strip)
Copper sheet plus cable bonding approach
The resource pad uses a Clip technique, and eviction makes use of a Cord technique. This bonding technique is a little cheaper than the all-copper bonding technique, conserving wafer location (applicable to very small entrance locations). The process is simpler than the all-copper bonding approach and can get better Rdson and far better thermal impact.
Supplier of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper metal, please feel free to contact us and send an inquiry.
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