Substrate materials used for electronic packaging must have high electrical resistance, good thermal conductivity and a low dielectric constant. The substrate for packaging should also be able to match silicon wafers thermally, have a high flatness surface, be easy-to-metallize, have a low cost and easy processing. Due to their high thermal conductivity, good high-frequency properties, good insulation properties and stable chemical properties of ceramics, they have become the most widely used substrate materials. Commonly used ceramic substrate materials include beryllium oxide, aluminum oxide, aluminum nitride, etc. Aluminum oxide ceramic substrates have a low thermal conductivity, and their thermal expansion coefficient is not comparable to that of silica. Beryllium dioxide has excellent properties but its powder can cause pronounced effects. Aluminum nitride has a high thermal conductivity. They are also resistant to thermal shock and have excellent mechanical properties.
Transparent ceramic materials
Transparency of ceramics refers to electromagnetic waves passing through the material within a particular electromagnetic frequency range. If electromagnetic waves within the infrared range can penetrate a sheet of ceramic, then the sheet is infrared-transparent ceramic. Pure aluminum-nitride ceramics, which are transparent and colorless crystals with good optical properties, can be used for heat-resistant coatings on high-temperature optical windows and fairings. Therefore, aluminum nitride The military uses ceramics in a variety of ways.
Applications of Aluminum Nitride in Machinery Industry
Aluminum nitride can be used to make wear-resistant components. Due to its high price, aluminum nitride can only replace severely worn parts. The oxidation and wear resistance of some metal or nonmetal surfaces can be improved by coating them with aluminum nitride. Aluminum nitride coatings can be used for anti-corrosion purposes, including the linings in containers and processing equipment that are corrosive.
Aluminum nitride high-temperature structure material
Aluminum nitride exhibits good corrosion resistance in ceramics both at high and low temperatures. Only at 2450degC will it decompose. As a high-temperature material, it can be used in crucibles and molds. Aluminum nitride can resist dissolution and is not affected by copper or aluminum. It is also resistant to high temperatures. It can be used as a container and protective layer for high temperature, such thermocouple protection tubes. For high-end semiconductor equipment like aluminum nitride chucks, corrosive gases are used. Since aluminum nitride has a high stability to molten sodium salts like gallium, it can be used as crucibles to synthesize semiconductors containing gallium.
Aluminum Nitride Composite
Composite material of epoxy and aluminum nitride. As a packaging product, this material must have excellent thermal and heat-dissipation abilities. This requirement is getting more and more stringent. The epoxy resin has good mechanical and chemical stability. It is also easy to cure. However, it has a very low thermal conductivity. Nano aluminum nitride, a powder with high thermal conductivity, can be added to epoxy resin in order to improve its thermal conductivity.
Titanium Nitride is used to create N/AlN composite materials. Titanium Nitride has excellent properties including high melting temperature, high hardness and electrical and thermal conductivity on the same scale as metal. It also exhibits corrosion resistance. The composite material is made by adding a small amount titanium nitride to the aluminum nitride matrix. According to conductive-percolation theory, when a certain amount of doping is reached, a conductive route forms in the crystal. This can be used to adjust the volume resistance of aluminum nitride-sintered bodies by 24 orders of magnitude. The composite ceramic materials made from these two materials are also characterized by high hardness, wear resistance, as well as the ability to be used for high-grade materials.
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