Silica is an example of silicon dioxide, with the chemical formula SiO2 in nature. It is also known as common quartz. The main ingredient of sand is silica. The most abundant and complex family of materials that includes silica is made up of many mineral compounds and synthesized products. fused-quartz, silica and opal are just a few examples.
It can be used to make structural materials and microelectronics (as an electrical insulator) and for components in the pharmaceutical and food industries.
What Is Spherical Silica Pulp?
Spherical powder features a flat surface, large surface area and strong chemical properties.
First, the powder is very fluid. The resin can be stirred evenly into a thin film. It is easy to add resin, but the quartz powder filling quantity is large. A mass fraction of up to 90% can be achieved. A higher filling quantity of quartz powder will result in a lower thermal conductivity. Additionally, the thermo expansion coefficient of the plastic sealing materials is less. However, monocrystal silica thermal expansion coefficients are closer to those of quartz.
Second, the stress for spherical granules is 60% less than that of angull powder. The stress concentration in plastic seals made with spherical Quartz powder is lowest, while the strength is highest. Finally, spherical powder has a smooth surface, a small friction coefficient and wear to the mold. The mold’s service life can also be increased by up to 1 time.
For what purpose is Spherical Silica Powder used?
Primarily used to make electronic packages. Three main components of electronic packaging materials are: substrate, plastic sealing material, lead frame, and solder. The advantages of plastic packaging include its simplicity, cost-effectiveness, affordability, and mass production. Plastic packaging currently accounts for over 95% in global integrated circuit markets. EMC (epoxy plastic package) is the mainstay of integrated circuit packaging. More than 95% use epoxy plastic seals for their microelectronic components.
The main requirements for integrated circuit packaging are low humidity resistance, low stress and dip resistance. Reflow welding is also an option. Inorganic fillers must be used in epoxy resin. Quartz powder is the most common inorganic material. Microelectronics has seen rapid advancement, making large-scale integration circuits more difficult to manufacture. Quartz powder serves as an important support for EMC materials. Not only does it conform to specific requirements of packaging material, but also its purity and low level of radioactive elements.
It is a good-looking powder of silicon, with high purity chemical elements and low levels of radioactive elements. This allows it to be compatible with high-end embedded circuits. The product can significantly reduce the temperature expansion coefficient of plastic sealing materials, lower its dielectric constant, increase stress and greatly improve rigidity.
Spherical Quartz Powder can be used not only in electronic packaging but also in high-grade cosmetics and high-grade precision ceramics. Precision grinding of opto devices and components is possible with precision.
Spherical Silica Powder Price
Price is affected by many things, such as the demand and supply in the market and industry trends. Economic activity. Unexpected events.
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Spherical Silica Powder Supplier
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